Friend Laser Photonics Co.,Ltd. participated in the "Optics Valley Qingtonghui Ultra CPO and Advanced Packaging Special Event."

Category: Company News

Release date: 2025-09-23

Summary: On September 22, at the Guanggu Qingtonghui Ultra CPO and Advanced Packaging Special Event, the Jiangcheng Integrated Circuit Super Incubator was officially unveiled. Built by Hubei Jiangcheng Laboratory, this incubator represents another exploration of the "Laboratory+" model by a new type of R&D institution.

On September 22, at the Guanggu Qingtonghui Ultra CPO and Advanced Packaging Special Event, the Jiangcheng Integrated Circuit Super Incubator was officially unveiled. Built by Hubei Jiangcheng Laboratory, this incubator represents another exploration of the "Laboratory+" model by a new type of R&D institution.


 

As Hubei's first incubator built on the foundation of a provincial-level laboratory, Jiangcheng Integrated Circuit Super Incubator has leveraged industry resources such as the Hubei Semiconductor Industry Association and the Hubei Electronics Society to provide robust support. Currently, it boasts an incubation space of 13,000 square meters, equipped with a domestically advanced 12-inch pilot-scale advanced packaging line, a 12-inch integrated circuit pilot production line, and pre-verification platforms for equipment, materials, and components. Additionally, the incubator has established an industrial fund exceeding 1 billion yuan in size.


 

The head of Jiangcheng Incubator told a reporter from Zhidian Finance that the incubator is positioned as a "super connector" in the integrated circuit sector, developing a "five-pointed star" incubation model encompassing a "source of innovation - technology breakthrough camp - enterprise nurturing program - AI-powered ecosystem - and platform for commercializing research outcomes." This comprehensive model provides projects with all essential incubation services, including concept validation, technology transfer, pilot-scale testing, investment support, ecosystem collaboration, and talent solutions.


 

The School of Integrated Circuits at Huazhong University of Science and Technology, Wuhan University, Wuhan University of Technology, Hubei University, and other universities, along with the Hubei Alumni Associations from Tsinghua University, Peking University, Fudan University, Nanjing University, and other institutions, have signed an agreement to jointly establish the Hubei Jiangcheng Laboratory. This collaboration will continuously bring in industry resources such as technical experts, cutting-edge research outcomes from university labs, and entrepreneurial alumni networks, fostering robust industrial synergy. To further strengthen its entrepreneurship support system, Jiangcheng Incubator has appointed renowned industry experts as mentors for startups and ceremonially presented them with official appointment letters on-site.


 

The incubator has also launched the "Xinchuang Camp" program, with the first batch of eight promising startups signing agreements to move in. These companies span critical areas such as semiconductor materials, advanced packaging, and photonic computing chips. The selected projects will be connected with industry leaders like Tencent Cloud, Huawei Smart Computing, and GaoYi Laser, fostering collaboration and resource sharing to accelerate the rapid commercialization and market application of high-quality initiatives in Optics Valley.


 

It is reported that "Xin Chuang Ying" will team up with institutions such as Guanggu Industry Investment, Jiangcheng Industry Investment Fund, and Luojia Venture Capital to form a venture capital partnership network, offering strategic investment support and empowerment, with individual investments potentially reaching tens of millions.


 

During the project pitch session, teams from Tsinghua University's expert group, Zhejiang University's expert team, the Wuhan National Laboratory for Optoelectronics, and universities such as Wuhan University presented a series of innovative technology projects.


 

The research team from Tsinghua University has developed China's first on-chip full-wave optical computing chip, earning multiple prestigious awards for its superior speed and ultra-low power consumption. Meanwhile, the team from Zhejiang University shared their high-throughput laser nanolithography technology, which significantly reduces chip manufacturing costs and was recognized as one of "China's Top Ten Optical Industry Technologies"—it has already been applied in the packaging field. Additionally, the research team from Wuhan National Laboratory for Optoelectronics presented a thin-film lithium niobate photonic integrated chip project, filling a critical gap in China by providing high-speed modulator chips domestically. Meanwhile, the research team at Wuhan University has created a chip-scale ultra-high-resolution thermal property analyzer, equipped with precise measurement capabilities at the micro- and nanoscale. This innovative tool offers vital support for thermal management in semiconductor and optoelectronic devices.


 

Ziguang Guoxin, Wuhan Xinliko, Friend Laser Photonics Co.,Ltd. and other companies showcased their technological breakthroughs in areas such as advanced packaging and optical devices.


 

Ziguang Guoxin's 3D heterogeneous integration optoelectronic co-packaging technology provides an efficient interconnection solution for AI computing clusters. Wuhan Xinlike's hybrid bonding/TCB bonding technology enables interconnection pitches down to sub-micron and even nanometer levels, significantly boosting data transmission bandwidth between chips. Meanwhile, Friend Laser Photonics Co.,Ltd.  is focusing on the next-generation 10-gigabit access networks, introducing 50G PON optical devices that leverage a three-generation network-compatible design and advanced cooling solutions to seize early market opportunities.

 

Keywords: Friend Laser Photonics Co.,Ltd. participated in the "Optics Valley Qingtonghui Ultra CPO and Advanced Packaging Special Event."

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