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Friend Laser

Photonics

Friend Laser

Photonics

Friend Laser

Photonics

Friend Laser

Photonics

Product Details
Y5010020003 1290nm SLD Laser Diode Butterfly (8pin LP) Module Specification

Y5010020003 1290nm SLD Laser Diode Butterfly (8pin LP) Module Specification

Category: SLD

Features:Center wavlength:1280~1300nm.

Product Details

PN: Y5010020003

1290nm SLD Laser Diode Butterfly(8PIN LP) Module Specification

Features

  •  Center wavelength:1280~1300nm. 
  •  Spontaneous emission light source, low ripple
  • Low polarization extinction ratio.
  • Wide-spectrum light source,with a spectral width greater than 40 nm.
  • High reliability design.
  • RoHS Compliant.
  • Case operating temperature: -40~70℃ .
  • 8-pin butterfly package: (With TEC).

Applications:

  • Fiber Optic Gyroscope
  • Optical Coherent Tomography(OCT)
  • Optical testing instruments
  • Optical fiber communication 

 

Description:

The low polarization extinction ratio、low ripple and wide-spectrum of 1290nm SLD laser module is a SLD laser chip in 8-pin butterfly package with thermoelectirc cooler(TEC), thermistor inside.

 

Absolute Maximum Ratings 

Table 1 - Absolute Maximum Ratings

ParameterSymbolMin.Max
Storage Temperature-5585
Case Operation Temperature -4070
Laser reverse voltage(T=25℃)V-2
Laser forward current(T=25℃)mA-150
TEC currentA 1.2
TEC voltageV 4
                                                                          Optical & Electrical Characteristics
ParameterSymbolMin.TypMaxUnitNote
central wavelengthλ0128012901300 nmT=15℃~35℃,IF=120mA
spectral bandwidthΔλ40--nmT=25℃,IF=120mA
Output Optical PowerPo3--mWT=25℃,IF=120mA
△P△P--6%Tcase=-40℃~70℃ IF=120mA
polarization extinction ratioPER--1.5dbIF=120mA,T=25℃
spectral rippleR-0.10.5dbT=25℃,IF=120mA
                                                                              Fiber Characteristics
ParameterMin.TypMaxUnitNote
Fiber type: YOFC SM BI1012-A      
Fiber length (module case to fiber end)2  m 
Connector    FC/APC
Jacket ∅900 um 

 

Mechanical Design Diagram and Pin Definitions.The mechanical design and Connections diagram is shown in Figure 1. (Dimension in mm)

Precautions 

Semiconductor chips are sensitive to electro-static damage. The module shall be packed with antistatic material for transportation. The working station and operators shall be grounded. Switching transients can cause electrical overstress (EOS) damage to the chips. EOS be may resulted from improper ESD handling, improper power sequencing, a faulty power supply or an intermittent connection. 

a. Operators should always use antistatic bands and clothing, electric conductive shoes, and other safety appliances while at work are highly recommended. 

b. Humidity in working environment should be controlled equal or above 40 percent RH. 

c. It is recommended that grounding mats be placed on the surfaces of assembly line workbench and the surrounding floor in working area, etc. 

d. When mounting this product in other parts or materials which can be electrically charged (printed wiring boards, plastic products, etc.), pay close attention to the static electricity in those parts.ESD may damage the product.

Keywords:Y5010020003 1290nm SLD Laser Diode Butterfly (8pin LP) Module Specification

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