Product Details

Friend Laser

Photonics

Friend Laser

Photonics

Friend Laser

Photonics

Friend Laser

Photonics

Product Details
Y3020040003 10G 1577nm DFB Laser Diode TO56 Specification

Y3020040003 10G 1577nm DFB Laser Diode TO56 Specification

Category: 10G DML TO

Features:1577nm typical emission wavelength

Product Details

PN: Y3020040003

10G 1577nm DFB Laser Diode TO56 Specification 

Features

  • 1577nm typical emission wavelength
  • Data rate up to 10.3125Gbps
  • TO56 package with TEC and 12.1mm aspheric lens
  • ROHS Compliant
  • Compliant with Telcordia GR-468

Applications:

 10G EPON OLT      XG COMBO OLT 

  

Description:

   The Product is a directly modulated 10Gbps 1577nm DFB laser diode devices in hermetic TO-56 package.The product is available with aspheric lens cap、NTC, and co-packaged InGaAs monitoring photodiode.

 

Absolute Maximum Ratings 

Table 1 - Absolute Maximum Ratings

ParameterSymbolMin.Max
Storage Temperature-4085
Operation Temperature(CASE)-1085
Laser reverse voltage(T=25℃)V-2
Laser forward current(T=25℃)mA-120
TEC currentA 0.94
TEC voltageV 2.4
PD reverse bias voltage(T=25℃)V 20
PD forward current(T=25℃) mA 2

 

                                                                             Optical & Electrical Characteristics
ParameterSymbolMin.TypMaxUnitNote
Threshold CurrentIth-815mAT=45℃
Output Optical PowerPo8--mWT=25℃,If=50mA
Forward voltageVf-1.11.6VT=25℃,CW
Operating currentIop--80nm/℃T=25℃,CW
Slope efficiencySe0.25--mw/mAT=25℃,CW
Center Wavelengthλ157515771580nmT=25℃,If=50mA
Side Mode Suppression RatioSMSR35--dBT=25℃,CW
Spectral widthΔλ-0.1-nmT=25℃,10Ghz at -20dB
ResistanceRs-810ΩT=25℃,If=50mA
Monitor PD CurrentIm100-1000μAT=25℃,If=50mA
Monitor Dark CurrentId--100nAT=25℃,Vr=-5v
Focus lengthFL11.612.112.6mmT=25℃,If=Ith+20mA
Resistance value (thermister)R-10-T=25℃

The Mechanical Design Diagram and Pin Definitions.The mechanical design diagram is shown in Figure 1. (Dimension in mm)

                 

 

Precautions 

Semiconductor chips are sensitive to electro-static damage. The module shall be packed with antistatic material for transportation. The working station and operators shall be grounded. Switching transients can cause electrical overstress (EOS) damage to the chips. EOS be may resulted from improper ESD handling, improper power sequencing, a faulty power supply or an intermittent connection. 

a. Operators should always use antistatic bands and clothing, electric conductive shoes, and other safety appliances while at work are highly recommended. 

b. Humidity in working environment should be controlled equal or above 40 percent RH. 

c. It is recommended that grounding mats be placed on the surfaces of assembly line workbench and the surrounding floor in working area, etc. 

d. When mounting this product in other parts or materials which can be electrically charged (printed wiring boards, plastic products, etc.), pay close attention to the static electricity in those parts.ESD may damage the product. 

 

Keywords:Y3020040003 10G 1577nm DFB Laser Diode TO56 Specification

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